Category: Electronic Thermal Management


ELECTRONIC THERMAL MANAGEMENT – TECHNOLOGIES, MATERIALS, DEVICES, NEW DEVELOPMENTS, INDUSTRY STRUCTURE AND GLOBAL MARKETS

 

“Thermal management” denotes the array of problem-solving design tools and material technologies that systems manufacturers apply to regulate the unwanted heat caused by the normal functioning of an electronic system. Increasing power densities and decreasing transistor dimensions are hallmarks of modern computer chips. Both trends are increasing the thermal management challenge within the chip and surrounding packaging, as well as accelerating research progress on high conductivity materials.

 

Dramatic changes are underway in the computer, telecommunications and consumer electronics industries. There is a trend toward systems “convergence,” combining computer, telecommunications and consumer system functions all into one system. There is also a trend toward micro-miniaturization and microsystem technologies integrating digital, optical, radio frequency and microelectromechanical systems (MEMS) devices. Microsystem packaging is at the heart of all of these products, since it is this technology that provides the system integration in addition to controlling the size, performance, reliability and cost of the final microsystem.

 

High-density packaging has been the trend in electronic circuits during the last decade, and that will continue for at least the next five years. In 2013, a typical megaprocessor could pack a staggering 41 million transistors onto a single chip. Running flat out, that chip would dissipate 130 watts of heat – more than a bright household light bulb – from an area the size of a postage stamp.

 

The trend line of the thermal management industry aligns with the developments of technology in the semiconductor, microprocessor and computer industries. For every advance in performance of these systems, there is a corresponding increase in the operating heat generated by the system. To simply say, however, that demands for thermal management products have increased as the requirements of applications have increased, does not do justice to the unique character of this industry. It is probably more accurate to state that the development of thermal management as an industry is the result of a synergy of solutions constantly engineered to manage excess heat in today’s electronic systems.

 

 

Study Goal and Objectives

 

The goal of this iRAP report is to provide an up-to-date analysis of recent developments and current trends in the global thermal management marketplace. The identification of significant drivers of revenue growth in specific product categories is an additional aim. The objective of this kind of systematic research is to quantify the projected impact of the forces — from within and from outside — at work on this industry today.

 

Products in this report have been grouped into four segments – hardware, software, interfaces and substrates. Product sub-segments within the hardware segment include heat sinks, fans and blowers, fan sinks, heat pipes, and cold plates – chosen because they are established technologies and represent revenue markets of significant size. The software segment focuses on modeling and analysis of the thermal characteristics of an electronic system. While the interface product line primarily attaches the heat sink to the system, several other product sub-segments in this technology are being applied to dissipate heat in applications where there is no room for a conventional heat sink. The categories of interfaces covered in this segment are thermal grease, thermal compounds, thermal pads, adhesive films and tapes, and epoxy. Finally, the report looks at substrates, focusing on two emerging package and component level products, thermally enhanced packages and heat spreaders.

 

Besides targeting the conventional market of thermal management products and solutions related to electronics usage in computers, telecomm, automotive, consumer, medical/office and industrial/military equipment, the report addresses electronics used in new applications such as high-power LEDs, power circuits used in renewal power (wind and solar) stations, high-performance embedded computing (HPEC) working at more than 5GHz frequency, and the growing industrial usage of electronics in laser machining and industrial robots.

 

The report also briefly discusses recent research work done on cooling solutions to address complex heat issues arising in commercialization of new three-dimensional integrated circuit (3DIC) chips intended for use in computers, tablets, cellular phones, set-top boxes, LCD monitors, digital cameras and video game consoles.

 

Reasons For Doing this Study

 

Development within the thermal industry is one of the most interesting sub-plots of the rapid innovation in the high-tech area. As the drive to achieve higher levels of device integration while reducing cost, size and complexity continues, the issue of managing heat and power dissipation has become very significant. Economic and market forces also are important factors. Consequently, current trends (market and technology), as well as potential breakthroughs in the near- and long-term future, become very important.

 

Contributions of the Study

 

The information presented here is for suppliers participating in the thermal management market with a vital interest in the market potential of a specific technology in one of the product segment markets. This study should also be of interest to companies in the electronic materials, software and other industries, that have an interest in the potential of their products in a thermal management application. In addition, because of this report’s business focus, it should be of use to executives and business managers as an up-to-the-minute guide to current conditions that are expected to be significant in tomorrow’s markets.

 

Format and Scope

 

The scope of this report is broad, and covers several product areas. The individual materials, hardware and software product segments are presented in terms of market size and revenue trends. The revenue forecasts are explained in terms of the key market issue for a specific product segment, and are projected for five years from 2013 to 2018. The application section features forecasts for the most important applications by product. The technology discussion concentrates on trends that will develop more significantly during the forecast period. The report also includes a discussion on the competitive aspects of each product segment, along with several successful suppliers’ strategies in the market. A current industry directory, a survey of U.S. thermal management patents from Jan. 2010 to Jan. 2014, and profiles of a selection of the leading thermal management suppliers are also included.

 

To Whom the Study Caters

 

The study will benefit existing and new manufacturers of electronic thermal management products, service providers and solution providers. This study also provides a technical overview of electronic thermal management products, service providers and solution providers, especially recent technology developments and existing barriers. Therefore, audiences for this study include marketing executives, business unit managers and other decision makers working in the area of electronic thermal management, as well as those in companies peripheral to these businesses.

 

Report Summary

 

The thermal management industry is moving toward comprehensive solutions to cool electronics. As a result, the dynamic in this market has not been one where there is a move toward a single technology or product that replaces others. The tendency is for systems designers to look at the entire problem and evaluate multiple options and combinations for a solution.

 

There are four main segments in thermal management technologies – hardware, software, interfaces, and substrates.

 

Components of thermal management pave the way for the electronics industry to develop high-performance applications. This report examines the range of thermal management products and solutions in the market today.

 

The worldwide market for thermal management products is predicted to grow from about $8.8 billion in 2013 to $15.56 billion by 2018, at an average annual growth rate (CAGR) of 12.1%.

 

 

Price:

 

$3,750.00 (Print Copy), $595 for second copy and $295 for 3rd copy onwards.
$3.950.00 (Single User License)
$5,450.00 (Multi-User License at the Same Location)
$6,950.00 (Enterprise License)

 

Contact 203-569-7909 for faster service

 

Published: December 2014 Report ID: ET-123 Pages: 206

 

 


ELECTRONIC THERMAL MANAGEMENT – TECHNOLOGIES, MATERIALS, DEVICES, NEW DEVELOPMENTS, INDUSTRY STRUCTURE AND GLOBAL MARKETS

 

 

 

TABLE OF CONTENTS

 

INTRODUCTION………………………………………………………………………………………………………… 1

STUDY GOALS AND OBJECTIVES………………………………………………………………. 2

REASONS FOR DOING THE STUDY…………………………………………………………….. 2

CONTRIBUTIONS OF THE STUDY………………………………………………………………. 3

SCOPE AND FORMAT……………………………………………………………………………………. 3

METHODOLOGY……………………………………………………………………………………………… 3

INFORMATION SOURCES…………………………………………………………………………….. 4

WHOM THE STUDY CATERS TO………………………………………………………………….. 5

AUTHOR’S CREDENTIALS……………………………………………………………………………. 5

EXECUTIVE SUMMARY…………………………………………………………………………………………… 7

SUMMARY TABLE WORLDWIDE REVENUE FOR THE THERMAL MANAGEMENT MARKET, 2013 AND 2018 …………………………………………………………………………………………………. 8

SUMMARY FIGURE WORLDWIDE REVENUES FOR THE THERMAL MANAGEMENT MARKET, 2013 AND 2018 …………………………………………………………………………………………………. 8

INDUSTRY OVERVIEW………………………………………………………………………………………….. 11

AN OVERVIEW OF THERMAL MANAGEMENT………………………………………. 12

INDUSTRY DRIVERS…………………………………………………………………………………… 13

TABLE 1 NEW ELECTRONICS DEVELOPMENTS IMPACTING

THERMAL MANAGEMENT PRODUCTS, 2013-2018…………………….. 13

TABLE 1 NEW ELECTRONICS DEVELOPMENTS IMPACTING TECHNOLOGY………………………………………………………………………………………………. 16

PHYSICAL ISSUES………………………………………………………………………………….. 17

FIGURE 1 MAJOR CAUSES OF ELECTRONIC FAILURE……………… 17

MARKET OVERVIEW…………………………………………………………………………………… 18

TABLE 2 WORLD THERMAL MANAGEMENT REVENUE ACCORDING

TO PRODUCT CATEGORIES, 2013 AND 2018 ……………………………….. 18

INDUSTRY DRIVERS AND STRUCTURE………………………………………………….. 18

FIGURE 2 TECHNOLOGY NEEDS AS A DRIVER FOR THERMAL MANAGEMENT  ……20

INDUSTRY STRUCTURE……………………………………………………………………………………….. 21

MERGERS AND ACQUISITIONS………………………………………………………………… 23

TABLE 3 MERGERS, ACQUISITIONS AND NEW FUNDINGS IN ELECTRONICS THERMAL MANAGEMENT FROM 2008 THROUGH 2013………………………………………………………. 23

TABLE 4 RESEARCH ORGANIZATIONS AND COMPANIES ACTIVELY ENGAGED IN ELECTRONIC THERMAL MANAGEMENT IN 2013………………………………………….. 24

TABLE 5 LEADING THERMAL CONSULTANTS AND INTEGRATORS…….25

TECHNOLOGY OVERVIEW……………………………………………………………………………………. 26

THERMAL MANAGEMENT………………………………………………………………………… 26

EFFECTIVE THERMAL DESIGN FOR ELECTRONIC SYSTEMS……………. 26

CONCEPT DEVELOPMENT PHASE PROCESS AND THERMAL TOOLS …..27

DETAILED DESIGN PHASE PROCESS AND THERMAL TOOLS….. 27

HARDWARE TEST PHASE PROCESS AND THERMAL TOOLS…… 28

TECHNICAL PROPERTIES………………………………………………………………………….. 29

TABLE 6 THERMAL PROPERTIES OF MATERIALS…………………….. 30

ELECTRONIC THERMAL MANAGEMENT MATERIALS………………………… 30

COMPOSITES……………………………………………………………………………………… 30

TABLE 7 METAL MATRIX COMPOSITES………………………………………. 31

CERAMICS………………………………………………………………………………………….. 31

ALUMINA (Al2O3)……………………………………………………………………………… 32

ALUMINUM NITRIDE (AlN)……………………………………………………………… 32

SILICON CARBIDE (SiC)…………………………………………………………………… 32

ALUMINUM SILICON CARBIDE (AlSiC)………………………………………… 33

BERYLLIUM OXIDE (BeO)…………………………………………………………………. 33

OTHER THERMAL MANAGEMENT MATERIALS…………………………. 33

CONDUCTORS…………………………………………………………………………………… 34

HIGH PERFORMANCE THERMAL MANAGEMENT MATERIALS………… 35

ADVANCED THERMAL SOLUTIONS IN PRACTICE IN 2013…………………. 37

FIGURE 3 LIQUID COOLING LOOP FOR HIGH PERFORMANCE ELECTRONICS ……. 38

CASE STUDY 1: THERMOELECTRIC COOLERS IN MODULE COOLING ENHANCEMENT ……39

CASE STUDY 2: SIGNIFICANCE IN CONTEMPORARY DATA CENTERS …… 39

CASE STUDY 3: COOLING METHODS FOR INDUSTRIAL ELECTRONICS  …..40

CASE STUDY 4: HIGH-POWER LEDS………………………………………………. 40

FIGURE 4 TYPICAL USAGE OF FAN-COOLED HEAT SINK IN HIGH-POWER LED ASSEMBLY…… 42

CASE STUDY 5: WIND POWER GENERATION………………………………. 42

CASE STUDY 6: SOLAR GRID-CONNECTED PHOTOVOLTAIC (PV) GENERATION…….42

GLOBAL ELECTRONIC THERMAL MANAGEMENT MARKETS………………………. 43

THERMAL MANAGEMENT PRODUCT CATEGORIES AND MARKETS.. 43

PRODUCT SUMMARY FORECASTS………………………………………………………….. 43

TABLE 8 GLOBAL REVENUE BY PRODUCT CATEGORY, 2013

AND 2018…………………………………………………………………………………………….. 44

FIGURE 5 GLOBAL REVENUE BY PRODUCT CATEGORY, 2013

AND 2018…………………………………………………………………………………………….. 44

GLOBAL AND REGIONAL TRENDS FOR THERMAL MANAGEMENT….. 45

TABLE 9 GLOBAL REVENUE BY REGION, 2013 AND 2018………… 46

FIGURE 6 WORLD THERMAL MANAGEMENT REVENUE BY REGION, 2013 AND 2018 …….46

NORTH AMERICA……………………………………………………………………………… 47

EUROPE………………………………………………………………………………………………. 47

ASIA/PACIFIC…………………………………………………………………………………….. 48

JAPAN…………………………………………………………………………………………………. 48

THERMAL MANAGEMENT END USE APPLICATION TRENDS AND

MARKETS……………………………………………………………………………………………………… 48

TABLE 10 GLOBAL HARDWARE REVENUE BY APPLICATION, 2013

AND 2018…………………………………………………………………………………………….. 49

FIGURE 7 GLOBAL REVENUE BY APPLICATION, 2013 AND 2018 49

COMPUTERS……………………………………………………………………………………… 50

TABLE 11 GLOBAL REVENUE – COMPUTER APPLICATIONS, 2013

AND 2018 ……………………………………………………………………………………………. 50

TELECOM……………………………………………………………………………………………. 50

TABLE 12 GLOBAL REVENUE – TELECOM APPLICATIONS, 2013

AND 2018 ……………………………………………………………………………………………. 51

Telecom and network industry challenges……………………………….. 51

AUTOMOTIVE INDUSTRY……………………………………………………………….. 52

TABLE 13 GLOBAL REVENUE – AUTOMOTIVE APPLICATIONS, 2013 AND 2018…… 53

CONSUMER PRODUCTS………………………………………………………………….. 53

TABLE 14 GLOBAL REVENUE – CONSUMER PRODUCTS, 2013 AND 2018 ……55

MEDICAL/OFFICE EQUIPMENT………………………………………………………. 55

TABLE 15 GLOBAL REVENUE – MEDICAL/OFFICE APPLICATIONS, 2013 AND 2018 …56

INDUSTRIAL/MILITARY EQUIPMENT……………………………………………. 56

TABLE 16 GLOBAL REVENUE – INDUSTRIAL/MILITARY

APPLICATIONS, 2013 AND 2018……………………………………………………… 57

INDUSTRY STUCTURE MARKET SHARES……………………………………………… 57

THERMAL MANAGEMENT HARDWARE MARKET……………………… 58

TABLE 17 GLOBAL HARDWARE REVENUES, 2013 AND 2018 …. 58

Global and regional trends for thermal management hardware…. 58

TABLE 18 GLOBAL HARDWARE REVENUE BY REGION, 2013 AND 2018 …..59

Thermal management hardware end use application trends…. 59

TABLE 19 GLOBAL HARDWARE REVENUE BY APPLICATION, 2013 AND 2018 ….60

Thermal management hardware sub-product categories………… 60

TABLE 20 GLOBAL HARDWARE REVENUE BY SUB-PRODUCTS, 2013 AND 2018 …….61

FIGURE 8 GLOBAL HARDWARE REVENUE BY SUB-PRODUCTS, 2013 AND 2018 …….61

Fans and blowers: overview………………………………………………………. 62

TABLE 21 FANS AND BLOWERS END USE APPLICATIONS, 2013 AND 2018 ……63

Heat sinks: overview…………………………………………………………………. 64

TABLE 22 HEAT SINKS END USE APPLICATIONS, 2013 AND 2018……..64

Heat pipes: overview…………………………………………………………………. 65

TABLE 23 HEAT PIPES END USE APPLICATIONS, 2013 AND 2018 66

Fan sinks: overview…………………………………………………………………… 66

TABLE 24 FAN SINKS END USE APPLICATIONS, 2013 AND 2018 67

Cold plates: overview………………………………………………………………… 68

TABLE 25 COLD PLATES END USE APPLICATIONS, 2013 AND 2018………  69

Thermoelectric coolers: overview………………………………………………. 71

TABLE 26 THERMOELECTRIC COOLERS END USE APPLICATIONS, 2013 AND 2018….. 72

New developments in hardware……………………………………………….. 73

FIGURE 9 LIQUID COOLING OF ELECTRONICS SYSTEMS……….. 74

TABLE 27 MAJOR DEVELOPMENTS IN HARDWARE IN ELECTRONICS THERMAL MANAGEMENT PRACTICES…………………………………………………………………………………… 75

THERMAL MANAGEMENT SOFTWARE…………………………………………………… 79

WORLDWIDE MARKET FORECAST………………………………………………… 79

TABLE 28 GLOBAL SOFTWARE REVENUES, 2013 AND 2018 ….. 79

THERMAL SOFTWARE MODELING OPTIONS………………………………. 80

GLOBAL AND REGIONAL TRENDS FOR THERMAL MANAGEMENT SOFTWARE ……..81

TABLE 29 SOFTWARE REVENUE BY REGION, 2013 AND 2018…. 81

THERMAL MANAGEMENT SOFTWARE END USE APPLICATION TRENDS………82

TABLE 30 SOFTWARE REVENUE BY APPLICATION, 2013 AND 2018……….82

FIGURE 10 SOFTWARE REVENUE BY APPLICATION, 2013 AND 2018…….83

TABLE 31 COMPUTER APPLICATIONS SOFTWARE SHARES, 2013 AND 2018 …….84

THERMAL MANAGEMENT SOFTWARE SUB-PRODUCT CATEGORIES……..84

TABLE 32 SOFTWARE REVENUE BY SUB-PRODUCTS, 2013 AND 2018…… 85

CFD: overview……………………………………………………………………………. 85

TABLE 33 CFD END USE APPLICATIONS, 2013 AND 2018 ……….. 86

CHT: overview…………………………………………………………………………… 86

TABLE 34 CHT END USE APPLICATIONS, 2013 AND 2018…………………..           87

Circuit design: overview……………………………………………………………. 87

TABLE 35 CIRCUIT DESIGN END USE APPLICATIONS, 2013 AND 2018……..88

Power management: overview…………………………………………………… 88

TABLE 36 POWER MANAGEMENT END USE APPLICATIONS, 2013 AND 2018 89

Other software: overview…………………………………………………………… 89

TABLE 37 OTHER SOFTWARE END USE APPLICATIONS, 2013 AND 2018 ………..90

TECHNOLOGY TRENDS IN THERMAL MANAGEMENT SOFTWARE ………90

TABLE 38 NEW DEVELOPMENTS IN SOFTWARE RELATED TO ELECTRONIC THERMAL MANAGEMENT………………………………………………………………………………………………………… 90

SOFTWARE INDUSTRY STRUCTURE AND MARKET SHARES…. 91

TABLE 39 MARKET SHARES OF MAJOR VENDORS – GLOBAL SOFTWARE MARKET FOR THERMAL MANAGEMENT, 2013………………………………………………………………….. 92

FIGURE11 MAJOR VENDORS IN THE GLOBAL THERMAL MANAGEMENT

SOFTWARE MARKET, 2013………………………………………………………. 92

THERMAL MANAGEMENT INTERFACE MATERIALS…………………………… 93

WORLDWIDE MARKET FORECAST………………………………………………… 93

TABLE 40 GLOBAL INTERFACE REVENUES, 2013 AND 2018 …. 93

GLOBAL AND REGIONAL TRENDS FOR THERMAL MANAGEMENT INTERFACE……..94

TABLE 41 INTERFACE REVENUE BY REGION, 2013 AND 2018.. 94

THERMAL MANAGEMENT INTERFACE END USE APPLICATION TRENDS ………94

TABLE 42 GLOBAL INTERFACE REVENUE BY APPLICATION, 2013 AND 2018……….96

FIGURE 12 GLOBAL INTERFACE REVENUE BY APPLICATION, 2013

AND 2018 ……………………………………………………………………………………………. 96

THERMAL MANAGEMENT INTERFACE SUB-PRODUCT CATEGORIES………97

TABLE 43 GLOBAL THERMAL MANAGEMENT INTERFACE

REVENUE BY SUB-PRODUCTS, 2013 AND 2018 …………………………. 98

Thermal grease: overview…………………………………………………………. 99

TABLE 44 GLOBAL GREASE END USE APPLICATIONS, 2013 AND 2018………99

Thermal compounds: overview……………………………………………….. 100

TABLE 45 GLOBAL THERMAL COMPOUND END USE

APPLICATIONS,2013 AND 2018 ……………………………………………………. 101

Thermal pads: overview………………………………………………………….. 101

TABLE 46 GLOBAL THERMAL PADS END USE APPLICATIONS, THROUGH 2018………102

Adhesive film and tape: overview…………………………………………… 102

TABLE 47 GLOBAL ADHESIVE FILM AND TAPE END USE APPLICATIONS,2013 AND 2018 103

Epoxy: overview……………………………………………………………………….. 103

TABLE 48 GLOBAL EPOXY END USE APPLICATIONS, 2013 TO 2018………….104

TECHNOLOGY TRENDS IN THERMAL MANAGEMENT INTERFACE………..105

TABLE 49 EXAMPLES OF THERMAL INTERFACE PROPERTIES …….105

TRENDS IN THERMAL MANAGEMENT INTERFACE………………… 106

TABLE 50 NEW DEVELOPMENTS IN THERMAL INTERFACE MATERIALS RELATED TO ELECTRONIC THERMAL MANAGEMENT IN 2013………………………………………… 106

TIM INDUSTRY STUCTURE AND MARKET SHARES………………… 107

TABLE 51 MARKET SHARES OF MAJOR VENDORS – GLOBAL INTERFACE MARKET, 2013…………..107

FIGURE 13 TOP VENDORS – GLOBAL INTERFACE MARKET, 2002……….. 108

THERMAL MANAGEMENT SUBSTRATES…………………………………………….. 109

WORLDWIDE MARKET FORECAST……………………………………………… 109

TABLE 52 GLOBAL THERMAL MANAGEMENT SUBSTRATE REVENUES, THROUGH 2018…………109

GLOBAL AND REGIONAL TRENDS FOR SUBSTRATE………………. 109

TABLE 53 SUBSTRATE REVENUE BY REGION, 2013 AND 2018 110

SUBSTRATE END USE APPLICATION TRENDS…………………………. 110

TABLE 54 GLOBAL SUBSTRATE REVENUE BY APPLICATION, THROUGH 2018 ($ MILLIONS)………..111

FIGURE 14 GLOBAL SUBSTRATE REVENUE BY APPLICATION, 2013 AND 2018………………112

THERMAL MANAGEMENT SUBSTRATE SUB-PRODUCT CATEGORIES …………….113

TABLE 55 SUBSTRATE REVENUE BY SUB-PRODUCTS, THROUGH 2018………… 114

Thermally-enhanced packages: overview……………………………….. 114

TABLE 56 GLOBAL THERMALLY-ENHANCED PACKAGES END

USE APPLICATIONS, 2013 AND 2018 ………………………………………….. 115

Heat spreader: overview…………………………………………………………. 116

Heat spreader: overview (CONT.)…………………………………………… 117

TABLE 57 GLOBAL THERMAL MANAGEMENT HEAT SPREADERS

END-USE APPLICATIONS, THROUGH 2008 ……………………………….. 118

Technology trends in substrates…………………………………………….. 118

TABLE 58 NEW DEVELOPMENTS IN THERMAL SUBSTRATES MATERIALS RELATED TO ELECTRONIC THERMAL MANAGEMENT IN 2013………………………………………… 118

INDUSTRY STUCTURE MARKET SHARES…………………………………. 119

TABLE 59 MARKET SHARES OF MAJOR VENDORS – GLOBAL SUBSTRATE MARKET, 2013  ……120

FIGURE 15 MARKET SHARES OF MAJOR VENDORS – GLOBAL SUBSTRATE MARKET, 2013……..120

PATENTS AND PATENT ANALYSIS…………………………………………………………………… 121

TABLE 60 NUMBER OF U.S. THERMAL MANAGEMENT PATENTS, 2010-2014…..121

OVERVIEW OF U.S. PATENT ACTIVITY IN THERMAL MANAGEMENT ……121

TABLE 61 NUMBER OF U.S. ELECTRONIC THERMAL

MANAGEMENT PATENTS ASSIGNED BY REGION, FROM

JANUARY 2010 THROUGH FEBRUARY 2014……………………………… 122

PATENTS: THERMAL MANAGEMENT HARDWARE……………………………. 122

TABLE 62   TOP U.S. ELECTRONIC THERMAL MANAGEMENT HARDWARE PATENT ASSIGNEES, JANUARY 2010 TO FEBRUARY 2014………………………………………. 123

FIGURE 16 TOP U.S. ELECTRONIC THERMAL MANAGEMENT HARDWARE PATENT ASSIGNEES, JANUARY 2010 TO FEBRUARY 2014………………………………………. 123

PUMP AND FAN CONTROL CONCEPTS IN A COOLING SYSTEM …..124

SEMICONDUCTOR PACKAGE THERMAL TAPE WINDOW FRAME FOR HEAT SINK ATTACHMENT……124

THERMOELECTRIC DEVICES INCLUDING THERMOELECTRIC ELEMENTS HAVING OFF-SET METAL PADS AND RELATED STRUCTURES, METHODS, AND SYSTEMS…….124

ASSEMBLIES AND METHODS FOR DISSIPATING HEAT FROM

HANDHELD ELECTRONIC DEVICES……………………………………………. 125

COOLING SYSTEMS INCORPORATING HEAT EXCHANGERS AND THERMOELECTRIC LAYERS ……125

ASSEMBLIES AND METHODS FOR DISSIPATING HEAT FROM HANDHELD ELECTRONIC DEVICES ……126

HEAT SINK FOR LED LIGHT BULB………………………………………………. 126

BONDED METAL AND CERAMIC PLATES FOR THERMAL MANAGEMENT OF OPTICAL AND ELECTRONIC DEVICES……………………………………………………………………………………… 126

HEAT SINK BASE PLATE WITH HEAT PIPE………………………………… 127

MICROHEAT EXCHANGER FOR LASER DIODE COOLING……….. 127

DEVICE AND METHODOLOGY FOR THE REMOVAL OF HEAT FROM AN EQUIPMENT RACK BY MEANS OF HEAT EXCHANGERS MOUNTED TO A DOOR……………………….. 127

SYSTEMS AND ASSOCIATED METHODS FOR CONTROLLABLY COOLING COMPUTER COMPONENTS …..128

CLAMP-TYPE HEAT SINK FOR MEMORY……………………………………. 128

METHODS OF FORMING EMBEDDED THERMOELECTRIC COOLERS WITH ADJACENT THERMALLY CONDUCTIVE FIELDS………………………………………………………………. 129

HOLISTIC THERMAL MANAGEMENT SYSTEM FOR A SEMICONDUCTOR CHIP…………………………………………….. 129

HEAT SINK FOR MEMORY AND MEMORY DEVICE HAVING HEAT SINK….. 129

SOLAR POWER SYSTEM WITH TOWER TYPE HEAT DISSIPATING STRUCTURE….. 130

THERMALLY CONDUCTIVE STRUCTURE OF LED AND MANUFACTURING METHOD THEREOF ….130

AIRFLOW INTAKE SYSTEMS AND ASSOCIATED METHODS FOR USE WITH COMPUTER CABINETS…..131

METHOD OF FABRICATING HIGH SURFACE TO VOLUME RATIO STRUCTURES AND THEIR INTEGRATION IN MICROHEAT EXCHANGERS FOR LIQUID COOLING SYSTEM….131

OPTIMAL SPREADER SYSTEM, DEVICE AND METHOD FOR FLUID COOLED MICRO-SCALED HEAT EXCHANGE…………………………………………………………………………………. 131

METHODOLOGY OF COOLING MULTIPLE HEAT SOURCES IN A PERSONAL COMPUTER THROUGH THE USE OF MULTIPLE FLUID-BASED HEAT EXCHANGING LOOPS COUPLED VIA MODULAR BUS-TYPE HEAT EXCHANGERS…………………………………………………………………. 132

HEAT DISSIPATION DEVICE…………………………………………………………. 132

METHODS OF FORMING THERMOELECTRIC DEVICES USING ISLANDS OF THERMOELECTRIC MATERIAL AND RELATED STRUCTURES…………………………….. 133

THERMAL MANAGEMENT SOFTWARE PATENTS……………………. 133

TABLE 63 TOP U.S. ELECTRONIC THERMAL MANAGEMENT SOFTWARE PATENT ASSIGNEES, JANUARY 2010 THROUGH FEBRUARY 2014…………………………………………… 133

FIGURE 17 TOP U.S. ELECTRONIC THERMAL MANAGEMENT SOFTWARE PATENT ASSIGNEES, JANUARY 2010 THROUGH FEBRUARY 2014………………………… 134

THERMAL ANALYSIS…………………………………………………………………….. 134

SYSTEM AND METHOD FOR ACCESSING A MULTIPHYSICS MODELING SYSTEM VIA A DESIGN SYSTEM USER INTERFACE……………………………………………………………………… 135

MODEL-BASED FILL……………………………………………………………………….. 135

MODEL-BASED DESIGN VERIFICATION…………………………………….. 135

MODELING AND SIMULATION METHOD……………………………………. 136

METHOD AND APPARATUS FOR MULTI-DIE THERMAL ANALYSIS……136

REDUCING THE SIZE OF A MODEL USING VISIBILITY FACTORS …..136

SIMULATION AND CORRECTION OF MASK SHADOWING EFFECT…….137

METHOD FOR ASSEMBLING THE FINITE ELEMENT

DISCRETIZATION OF ARBITRARY WEAK EQUATIONS…………….. 137

SELECTIVELY REDUCING THE NUMBER OF CELL EVALUATIONS IN A HARDWARE SIMULATION…….138

LOCALLY UPDATING A THREE-DIMENSIONAL MODEL………….. 138

SYSTEMS, METHODS, AND TOOLS FOR PROOFING A

COMPUTER-AIDED DESIGN OBJECT…………………………………………… 138

PROCESS FOR DISPLAYING OBJECTS OF A PLM DATABASE AND APPARATUS IMPLEMENTING THIS PROCESS…………………………………………………………………………………….. 139

PATENTS: THERMAL MANAGEMENT INTERFACE………………….. 139

TABLE 64 TOP U.S. ELECTRONIC THERMAL MANAGEMENT INTERFACE MATERIALS PATENT ASSIGNEES, JANUARY 2010 TO FEBRUARY 2014……………….. 140

FIGURE 18 TOP U.S. ELECTRONIC THERMAL MANAGEMENT INTERFACE MATERIALS PATENT ASSIGNEES, JANUARY 2010 TO FEBRUARY 2014……………….. 140

THERMAL INTERFACE MATERIAL WITH THIN TRANSFER FILM OR METALLIZATION……141

THERMALLY CONDUCTIVE DEVICE WITH A THERMAL INTERFACE MATERIAL…….141

METHOD AND SYSTEM FOR ALIGNMENT OF GRAPHITE NANOFIBERS FOR ENHANCED THERMAL INTERFACE MATERIAL PERFORMANCE……………………………… 141

SYSTEM INCLUDING THERMAL CONTROL UNIT HAVING CONDUIT FOR DISPENSE AND REMOVAL OF LIQUID THERMAL INTERFACE MATERIAL………………………….. 142

THERMAL INTERFACE MATERIALS AND METHODS FOR MAKING THEREOF 142

REINFORCED RESIN-DERIVED CARBON FOAM……………………….. 143

FLEXIBLE GRAPHITE FLOORING HEAT SPREADER…………………. 143

THERMAL INTERFACE MATERIAL AND SEMICONDUCTOR COMPONENT INCLUDING THE THERMAL INTERFACE MATERIAL……………………………………………………………. 143

UNIFORM GRAPHITE PLATE………………………………………………………… 144

HIGH STRENGTH MONOLITHIC CARBON FOAM……………………… 144

THERMAL MANAGEMENT OF ELECTRONIC DEVICES…………… 144

HIGHLY THERMALLY-CONDUCTIVE MOLDABLE THERMOPLASTIC COMPOSITES AND COMPOSITIONS………………………………………………………………………………………………………. 145

HEAT SPREADER FOR PLASMA DISPLAY PANEL…………………….. 145

METHOD FOR PACKAGING THERMAL INTERFACE MATERIALS 145

THERMAL INTERFACE WITH NON-TACKY SURFACE…………….. 146

CARBON FOAM EVAPORATOR…………………………………………………….. 146

DIMENSIONALLY STABLE, LEAK-FREE GRAPHITE SUBSTRATE 146

CARBON FOAM CORE PANELS……………………………………………………. 146

METHOD AND ARRANGEMENT FOR COOLING A SUBSTRATE, PARTICULARLY A EMICONDUCTOR …..147

CARBON FOAM WITH SUPPLEMENTAL MATERIAL……………….. 147

HEAT SPREADING CIRCUIT ASSEMBLY…………………………………….. 147

LAYOUT OF POWER SEMICONDUCTOR CONTACTS ON A COOLING SURFACE……148

ENHANCED DIRECTIONAL CONDUCTIVITY OF GRAPHITIZABLE FOAM ….148

SANDWICHED THERMAL SOLUTION…………………………………………. 148

AREA WEIGHT UNIFORMITY FLEXIBLE GRAPHITE SHEET MATERIAL….149

CARBON FOAM STRUCTURAL INSULATED PANEL………………… 149

THERMALLY AND ELECTRICALLY CONDUCTIVE INTERCONNECT STRUCTURES…..149

REINFORCED RESIN-DERIVED CARBON FOAM……………………….. 150

THERMOFORMED PLATFORM…………………………………………………….. 150

HEAT SPREADER FOR DISPLAY PANEL……………………………………… 150

HIGH PURITY NUCLEAR GRAPHITE……………………………………………. 151

LOW CTE HIGHLY ISOTROPIC GRAPHITE………………………………….. 151

PATENTS: THERMAL MANAGEMENT SUBSTRATES………………. 151

TABLE 65 TOP U.S. ELECTRONIC THERMAL MANAGEMENT SUBSTRATES PATENT ASSIGNEES, JANUARY 2010 TO

FEBRUARY 2014……………………………………………………………………………… 152

FIGURE 19 TOP U.S. ELECTRONIC THERMAL MANAGEMENT SUBSTRATES PATENT ASSIGNEES, JANUARY 2010 TO FEBRUARY 2014………………………………………. 153

HEAT SPREADER FOR CENTER GATE MOLDING……………………… 154

HEAT SPREADER AS MECHANICAL REINFORCEMENT FOR ULTRA-THIN DIE……154

USER-SERVICEABLE LIQUID DIMM COOLING SYSTEM…………. 154

COOLING MEMORY MODULES USING COLD PLATE BLADES COUPLED TO THE MEMORY MODULES VIA CLIPS……………………………………………………………………………………………. 155

THREE-DIMENSIONAL SEMICONDUCTOR ASSEMBLY BOARD

WITH BUMP/FLANGE SUPPORTING BOARD, CORELESS

SEMICONDUCTOR DEVICE WITH HEAT  SPREADER……………………………….   155

BUILD-UP CIRCUITRY AND BUILT-IN ELECTRONIC DEVICE… 155

BALL GRID ARRAY PACKAGE WITH IMPROVED THERMAL CHARACTERISTICS……156

ON-CHIP HEAT SPREADER……………………………………………………………. 156

SEMICONDUCTOR PACKAGE WITH THERMAL HEAT

SPREADER……………………………………………………………………………………….. 156

ON-CHIP HEAT SPREADER……………………………………………………………. 157

METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A POST/BASE HEAT SPREADER WITH AN ESD PROTECTION LAYER………………………………………………….. 157

SEMICONDUCTOR CHIP ASSEMBLY WITH BUMP/BASE HEAT SPREADER AND DUAL-ANGLE CAVITY IN BUMP…………………………………………………………………………………………… 158

ENHANCED THERMAL MANAGEMENT OF 3-D STACKED DIE PACKAGING……. 158

HEAT DISSIPATION DEVICE…………………………………………………………. 158

METHOD OF FORMING ELECTRONIC PACKAGE HAVING FLUID-CONDUCTING CHANNEL……159

SEMICONDUCTOR DEVICE THERMAL CONNECTION…………….. 159

BALL GRID ARRAY PACKAGE STACKING SYSTEM………………….. 160

BALL GRID ARRAY PACKAGE SYSTEM………………………………………. 160

DIE-UP BALL GRID ARRAY PACKAGE WITH DIE-ATTACHED HEAT SPREADER……160

PACKAGING OF INTEGRATED CIRCUITS WITH CARBON NANOTUBE ARRAYS TO ENHANCE HEAT DISSIPATION THROUGH A THERMAL INTERFACE…………….. 161

SILICON CARBIDE SEMICONDUCTOR DEVICE HAVING JUNCTION FIELD EFFECT TRANSISTOR AND METHOD FOR MANUFACTURING THE SAME……………………… 161

METHOD OF MANUFACTURING SILICON CARBIDE

SEMICONDUCTOR DEVICE…………………………………………………………… 162

METHOD OF MANUFACTURING SILICON CARBIDE

SEMICONDUCTOR DEVICE…………………………………………………………… 162

APPENDIX I – PROFILES OF COMPANIES PRODUCING AND SUPPLYING ELECTRONIC THERMAL MANAGEMENT HARDWARE……………………………………………………………………………………………………… 163

AAVID THERMAL TECHNOLOGIES………………………………………………………… 163

ADDA-TAIWAN…………………………………………………………………………………………… 163

……………………

……………………

WAKEFIELD-VETTE…………………………………………………………………………………… 177

XCELAERO CORPORATION……………………………………………………………………… 178

APPENDIX II – PROFILES OF COMPANIES PRODUCING AND SUPPLYING ELECTRONIC THERMAL MANAGEMENT SOFTWARES…………………………………………………………………………………………………….. 179

AAVID DESIGN…………………………………………………………………………………………… 179

ADVANCED THERMAL SOLUTIONS, INC……………………………………………… 180

………………….

…………………

SYNOPSYS, INC………………………………………………………………………………………….. 185

THERMACORE, INC…………………………………………………………………………………… 185

APPENDIX III – PROFILES OF COMPANIES PRODUCING AND SUPPLYING ELECTRONIC THERMAL MANAGEMENT INTERFACE MATERIALS……………………………………………………………………………….. 187

3M…………………………………………………………………………………………………………………. 187

AOS THERMAL COMPOUNDS…………………………………………………………………. 187

…………………………….

…………………………….

T-GLOBAL THERMAL TECHNOLOGY CO., LTD…………………………………….. 199

WAKEFIELD–VETTE, INC…………………………………………………………………………. 199

APPENDIX IV – PROFILES OF COMPANIES PRODUCING AND SUPPLYING ELECTRONIC THERMAL MANAGEMENT SUBSTRATES…………………………………………………………………………………………………… 200

AMKOR ELECTRONICS, INC……………………………………………………………………. 200

ASAT…………………………………………………………………………………………………………….. 200

……………………..

……………………..

SUMITOMO ELECTRIC U.S.A., INC…………………………………………………………. 205

VISHAY SILICONIX………………………………………………………..……….206

 

 

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Published: December 2014 Report ID: ET-123 Pages: 206

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INNOVATIVE RESEARCH AND PRODUCTS, INC.

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GLOBAL MARKET FOR THERMAL MANAGEMENT PRODUCTS IS EXPECTED TO REACH $15.56 BILLION BY 2018.

The thermal management industry is moving toward comprehensive solutions to cool electronics and paving the way for the electronics industry to develop high-performance applications. As a result, the dynamic in this market has not been one where there is a move toward a single technology or product that replaces others. The tendency is for systems designers to look at the entire problem and evaluate multiple options and combinations for a solution.

According to a recently published report from iRAP, Inc., Electronic Thermal Management – Technology, Materials, Devices, New Developments, Industry Structure and Global Markets, the world market for thermal management products is predicted to grow from about $8.8 billion in 2013 to $15.56 billion by 2018, at an average annual growth rate (CAGR) of 12.1%.

“Thermal management” denotes the array of problem-solving design tools and material technologies that systems manufacturers apply to regulate the unwanted heat caused by the normal functioning of an electronic system. Increasing power densities and decreasing transistor dimensions are hallmarks of modern computer chips. Both trends are increasing the thermal management challenge within the chip and surrounding packaging, as well as accelerating research progress on high conductivity materials.

The trend line of the thermal management industry aligns with the development of technology in the semiconductor, microprocessor and computer industries. For every advance in performance of these systems, there is a corresponding increase in the operating heat generated by the system. It is probably more accurate to state that the development of thermal management as an industry is the result of a synergy of solutions constantly engineered to manage excess heat in today’s electronic systems.

There are four main segments in thermal management technologies – hardware, software, interfaces, and substrates. According to the new iRAP report, the hardware segment maintained its number one position with largest share of the market in 2013. This is followed by substrates, thermal interface materials and the software segment.

The overview of end-user trends shows the largest market in 2013 was for computers, followed by telecommunications, industrial/military industries, medical/office equipment, automotive and consumer products.

The thermal management industry is made up of companies from several industries that supply cooling solutions to manufacturers of electronic systems. The industry itself is structured around the applications that require thermal management. It is made up of component producers, specialty chemical companies, consultants and programmers.

 

SUMMARY TABLE

WORLDWIDE REVENUE FOR THE THERMAL MANAGEMENT MARKET, 2013 and 2018
($ Millions)


2013

2018

CAGR (%)   2013-’18

Total

$8,800

$15,560

12.1%

Source: iRAP, Inc.

 

 

 

SUMMARY FIGURE

WORLDWIDE REVENUE FOR THETHERMAL MANAGEMENT MARKET, 2013 and 2018
($ Millions)

 Untitled

 

 

 

 

Source: iRAP, Inc.

 

 

 

 

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Published Date: December 2014                                                                 Price (Hard Copy): $3,750

 

Data and analysis extracted from this press release must be accompanied by a statement identifying  iRAP, Inc., P.O. Box 16760, Stamford, CT 06905,  USA, Telephone: (203) 569-7909, Email: marketing@innoresearch.net as the source and publisher. Thank you.